Geodesic
Prediction of durability of soldered contact joints of chips
Vestnik Tomskogo gosudarstvennogo universiteta. Matematika i mehanika, no. 76 (2022), pp. 43-55 Cet article a éte moissonné depuis la source Math-Net.Ru

Voir la notice de l'article

The study is aimed at developing a nondestructive testing method for electronic equipment and its components. This method allows one to identify critical design defects of printed circuit boards (PCB) and to predict their service life taking into account the nature of probable operating loads. The study uses an acoustic emission method to identify and localize critical design defects of printed circuit boards. Geometric dimensions of detected critical defects can be determined by X-ray tomography. Based on the results of the study, a method combining acoustic emission and X-ray tomography has been developed for nondestructive testing of printed circuit boards. The stress-strain state of solder joints containing detected defects is analyzed. Durability is predicted using the damage function of the material, experimental fatigue curve with allowance for rheological properties of materials, the temperature effects, and complex stress-strain state. The results of using the developed method for estimating the degree of damage of the electronic board have been verified based on the experimental results of studies carried out in accordance with IPC-9701. The prediction error does not exceed 5%.
Keywords: printed circuit boards, solder joint, chip, latent defect, nondestructive testing method, reliability, durability. 
@article{VTGU_2022_76_a3,
     author = {A. V. Azin and N. N. Maritsky and S. V. Ponomarev and S. V. Rikkonen},
     title = {Prediction of durability of soldered contact joints of chips},
     journal = {Vestnik Tomskogo gosudarstvennogo universiteta. Matematika i mehanika},
     pages = {43--55},
     year = {2022},
     number = {76},
     language = {ru},
     url = {http://geodesic.mathdoc.fr/item/VTGU_2022_76_a3/}
}
TY  - JOUR
AU  - A. V. Azin
AU  - N. N. Maritsky
AU  - S. V. Ponomarev
AU  - S. V. Rikkonen
TI  - Prediction of durability of soldered contact joints of chips
JO  - Vestnik Tomskogo gosudarstvennogo universiteta. Matematika i mehanika
PY  - 2022
SP  - 43
EP  - 55
IS  - 76
UR  - http://geodesic.mathdoc.fr/item/VTGU_2022_76_a3/
LA  - ru
ID  - VTGU_2022_76_a3
ER  - 
%0 Journal Article
%A A. V. Azin
%A N. N. Maritsky
%A S. V. Ponomarev
%A S. V. Rikkonen
%T Prediction of durability of soldered contact joints of chips
%J Vestnik Tomskogo gosudarstvennogo universiteta. Matematika i mehanika
%D 2022
%P 43-55
%N 76
%U http://geodesic.mathdoc.fr/item/VTGU_2022_76_a3/
%G ru
%F VTGU_2022_76_a3
A. V. Azin; N. N. Maritsky; S. V. Ponomarev; S. V. Rikkonen. Prediction of durability of soldered contact joints of chips. Vestnik Tomskogo gosudarstvennogo universiteta. Matematika i mehanika, no. 76 (2022), pp. 43-55. http://geodesic.mathdoc.fr/item/VTGU_2022_76_a3/

[1] 5 glavnykh prichin otkaza payanykh soedinenii, Soft engineering group, 2020 https://www.ansys.soften.com.ua/about-ansys/blog/544-top-5-reasons-solder-joint-failure.html

[2] What is a Solder Void?, PCB Directory, 2020 https://www.pcbdirectory.com/community/what-is-solder-voiding

[3] Hillman D., Adams D., Pearson T., Williams B., Petrick B., Wilcoxon R., The last will and testament of the BGA void, 2011, 15 pp. https://www.circuitinsight.com/pdf/last_testament_bga_void_smta.pdf

[4] Azin A., Zhukov A., Narikovich A., Ponomarev S., Rikkonen S., Leitsin V., “Nondestructive testing method for a new generation of electronics”, MATEC Web of Conferences, 143 (2018), 04007 | DOI

[5] Ponomarev S. V., Rikkonen S., Azin A., Karavatskiy A., Maritskiy N., Ponomarev S.A., “The applicability of acoustic emission method to modeling the endurance of metallic construction elements”, IOP Conference Series: Materials Science and Engineering, 71:1 (2015), 012056 | DOI

[6] Simonov Yu.N., Simonov M.Yu., Fizika prochnosti i mekhanicheskie ispytaniya metallov, kurs lektsii, Izd-vo Perm. nats. issled. politekhn. un-ta, Perm, 2020

[7] Muzyka N.R., Schvets V.P., “Vliyanie vida nagruzheniya na protsess nakopleniya povrezhdenii v materiale”, Problemy prochnosti, 2014, no. 1, 130–136

[8] Luchkin R.S., Prochnost i nadezhnost payanykh konstruktsii, Izd-vo Tolyattinskogo gos. un-ta, Tolyatti, 2014

[9] Ivanov A.V., Piganov M.N., “Otsenka kachestva payanykh soedinenii elektronnykh uzlov”, Izvestiya Samarskogo nauchnogo tsentra Rossiiskoi akademii nauk, 18:4-7 (2016), 1381–1386

[10] Parfenov A.N., “Vvedenie v teoriyu prochnosti payanykh soedinenii”, Tekhnologii v elektronnoi promyshlennosti, 2008, no. 2, 46–52

[11] Lokoschenko A.M., “Ekvivalentnye napryazheniya v raschetakh dlitelnoi prochnosti metallov pri slozhnom napryazhennom sostoyanii (obzor)”, Izvestiya Saratovskogo universiteta. Novaya seriya. Ser. Matematika. Mekhanika. Informatika, 9:4 (2009), 128135 | DOI

[12] Bansal A., Ramakrishna G., Liu K., “Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission”, IPC APEX EXPO Proceedings, 2011, 12 pp.

[13] Moskvitin V.V., Soprotivlenie vyazkouprugikh materialov, Nauka, M., 1972

[14] Otiaba K.C., Bhatti R.S., Ekere N.N., Mallik S., Ekpu M., “Finite element analysis of the effect of silver content for Sn-Ag-Cu alloy compositions on thermal cycling reliability of solder die attach”, Engineering Failure Analysis, 28 (2013), 192–207 | DOI

[15] Ladani L.J., Dasgupta A., “A meso-scale damage evolution model for cyclic fatigue of viscoplastic materials”, International J. of Fatigue, 31 (2009), 703–711 | DOI