Geodesic
Assembly of electronic modules of infrared radiation receivers with the use of solder preforms
Problemy fiziki, matematiki i tehniki, no. 3 (2024), pp. 81-85.

Voir la notice de l'article provenant de la source Math-Net.Ru

The methods and modes of technological operations for attaching solder preforms to the base of the housing for mounting the crystal and sealing electronic modules of infrared receivers, which ensure their reliable fixation on metalized surfaces, are described. The dependences of the fastening strength of the preforms on the modes of operations are determined.
Keywords: infrared radiation receivers, crystal assembly, sealing, preform, welding, soldering. 
@article{PFMT_2024_3_a13,
     author = {A. E. Vidritskiy and V. L. Lanin},
     title = {Assembly of electronic modules of infrared radiation receivers with the use of solder preforms},
     journal = {Problemy fiziki, matematiki i tehniki},
     pages = {81--85},
     publisher = {mathdoc},
     number = {3},
     year = {2024},
     language = {ru},
     url = {http://geodesic.mathdoc.fr/item/PFMT_2024_3_a13/}
}
TY  - JOUR
AU  - A. E. Vidritskiy
AU  - V. L. Lanin
TI  - Assembly of electronic modules of infrared radiation receivers with the use of solder preforms
JO  - Problemy fiziki, matematiki i tehniki
PY  - 2024
SP  - 81
EP  - 85
IS  - 3
PB  - mathdoc
UR  - http://geodesic.mathdoc.fr/item/PFMT_2024_3_a13/
LA  - ru
ID  - PFMT_2024_3_a13
ER  - 
%0 Journal Article
%A A. E. Vidritskiy
%A V. L. Lanin
%T Assembly of electronic modules of infrared radiation receivers with the use of solder preforms
%J Problemy fiziki, matematiki i tehniki
%D 2024
%P 81-85
%N 3
%I mathdoc
%U http://geodesic.mathdoc.fr/item/PFMT_2024_3_a13/
%G ru
%F PFMT_2024_3_a13
A. E. Vidritskiy; V. L. Lanin. Assembly of electronic modules of infrared radiation receivers with the use of solder preforms. Problemy fiziki, matematiki i tehniki, no. 3 (2024), pp. 81-85. http://geodesic.mathdoc.fr/item/PFMT_2024_3_a13/

[1] V.N. Ovsyuk, V.V. Shashkin, M.A. Demyanenko i dr., “Neokhlazhdaemye matrichnye mikrobolometricheskie priemniki IK izlucheniya na osnove zol-gel VO”, Prikladnaya fizika, 2005, no. 6, 114-117

[2] V.S. Feschenko, A.A. Altukhov, A.Yu. Mityagin i dr., “O vozmozhnosti sozdaniya kompleksirovannogo integralnogo matrichnogo fotopriemnika dlya IK i UF diapazonov spektra na osnove mikrobolometrov i karbida kremniya”, Izvestiya akademii Inzhenernykh Nauk im. A.M. Prokhorova, 2013, no. 3, 84-88

[3] D. Murphy, M. Ray, J. Wyles, J. Asbrock, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, A. Kennedy, S. Baur, D. Van Lue, “Performance Improvements for VOx Microbolometer FPAs”, Proc. SPIE, 5406, 2004, 531-540 | DOI

[4] A. Vidritskii, V. Lanin, “Vakuumplotnaya germetizatsiya mikrobolometrov”, Elektronika: Nauka, Tekhnologiya, Biznes, 2023, no. 2, 60-66

[5] S.P. Timoshenkov, A.N. Boiko, B.M. Simonov, “Tekhnologii vakuumnoi germetizatsii MEMS”, Izvestiya vuzov. - Elektronika, 2010, no. 1, 11-23

[6] L.K. Edwards, R.S. Lakes, W.A. Nixon, “Viscoelastic behavior of 80In15Pb5Ag and 50Sn50Pb alloys: Experiment and modeling”, Journal of Applied Physics, 87:3 (2000), 1135-1140 | DOI