Geodesic
Aqueous compositions based on nanosized silica particles for chemical-mechanical polishing of silicon wafers
Problemy fiziki, matematiki i tehniki, no. 3 (2014), pp. 26-31.

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The method of preparation of suspensions based on nano-sized particles of fumed silica is described. The process and results of chemical-mechanical polishing of silicon wafers carried out in industrial environments are investigated. Recommendations on the use of polishing compositions in the chemical-mechanical polishing are making. When using the polishing suspensions SPS-81M and SPS-55M in the process of single-crystal silicon wafer CMP, high structural perfection and atomic smoothness of the surface roughness are achieved at the level of tenths of a nanometer.
Keywords: chemical-mechanical polishing, fumed silica, nanosized particles, roughness.
Mots-clés : surface 
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     author = {Ya. A. Kosenok and V. E. Gaishun and O. I. Tyulenkova and V. G. Denisman},
     title = {Aqueous compositions based on nanosized silica particles for chemical-mechanical polishing of silicon wafers},
     journal = {Problemy fiziki, matematiki i tehniki},
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Ya. A. Kosenok; V. E. Gaishun; O. I. Tyulenkova; V. G. Denisman. Aqueous compositions based on nanosized silica particles for chemical-mechanical polishing of silicon wafers. Problemy fiziki, matematiki i tehniki, no. 3 (2014), pp. 26-31. http://geodesic.mathdoc.fr/item/PFMT_2014_3_a4/

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