Temperature influence study on copper selenide films
Nanosistemy: fizika, himiâ, matematika, Tome 7 (2016) no. 4, pp. 699-702
Cet article a éte moissonné depuis la source Math-Net.Ru
Copper selenide was prepared by film is successfully deposited on a Fluorine-doped Tin Oxide (FTO) substrate by a brush plating technique. The film was uniform, had good adherence to the substrate and was annealed at 300$^\circ$ C and 500$^\circ$C. As the annealing temperature increased, the orientation of the crystallites is more randomized than in the as-prepared film. The structural and optical properties of the film were investigated by XRD, SEM, EDAX, UV-Visible and PL. The XRD pattern indicated that this film was crystalline in the structure.
Keywords:
Brush plating, copper selenide, optical properties.
@article{NANO_2016_7_4_a25,
author = {V. Rajendran and S. Arulmozhi Packiaseeli and S. Muthumari and R. Vijayalakshmi},
title = {Temperature influence study on copper selenide films},
journal = {Nanosistemy: fizika, himi\^a, matematika},
pages = {699--702},
year = {2016},
volume = {7},
number = {4},
language = {en},
url = {http://geodesic.mathdoc.fr/item/NANO_2016_7_4_a25/}
}
TY - JOUR AU - V. Rajendran AU - S. Arulmozhi Packiaseeli AU - S. Muthumari AU - R. Vijayalakshmi TI - Temperature influence study on copper selenide films JO - Nanosistemy: fizika, himiâ, matematika PY - 2016 SP - 699 EP - 702 VL - 7 IS - 4 UR - http://geodesic.mathdoc.fr/item/NANO_2016_7_4_a25/ LA - en ID - NANO_2016_7_4_a25 ER -
%0 Journal Article %A V. Rajendran %A S. Arulmozhi Packiaseeli %A S. Muthumari %A R. Vijayalakshmi %T Temperature influence study on copper selenide films %J Nanosistemy: fizika, himiâ, matematika %D 2016 %P 699-702 %V 7 %N 4 %U http://geodesic.mathdoc.fr/item/NANO_2016_7_4_a25/ %G en %F NANO_2016_7_4_a25
V. Rajendran; S. Arulmozhi Packiaseeli; S. Muthumari; R. Vijayalakshmi. Temperature influence study on copper selenide films. Nanosistemy: fizika, himiâ, matematika, Tome 7 (2016) no. 4, pp. 699-702. http://geodesic.mathdoc.fr/item/NANO_2016_7_4_a25/