Geodesic
Modeling of the kinetics of reactive diffusion of gallium in copper particles
Nanosistemy: fizika, himiâ, matematika, Tome 6 (2015) no. 3, pp. 332-345 Cet article a éte moissonné depuis la source Math-Net.Ru

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The results of experimental studies for the formation kinetics of an intermetallic compound in the diffusion of gallium in copper are discussed. The mathematical model for the experimental study made it possible to calculate the diffusion coefficient of gallium in copper. A mathematical model for the kinetics of intermetallic compound formation at the reactive diffusion of gallium in a copper particle allows one to estimate the solidification time for diffusion-curing paste-based solder consisting of molten gallium and copper powder.
Keywords: solder, gallium, copper, kinetics.
Mots-clés : reactive diffusion, intermetallic 
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     author = {S. V. Dzyubanenko and V. D. Luk'yanov},
     title = {Modeling of the kinetics of reactive diffusion of gallium in copper particles},
     journal = {Nanosistemy: fizika, himi\^a, matematika},
     pages = {332--345},
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     volume = {6},
     number = {3},
     language = {en},
     url = {http://geodesic.mathdoc.fr/item/NANO_2015_6_3_a2/}
}
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S. V. Dzyubanenko; V. D. Luk'yanov. Modeling of the kinetics of reactive diffusion of gallium in copper particles. Nanosistemy: fizika, himiâ, matematika, Tome 6 (2015) no. 3, pp. 332-345. http://geodesic.mathdoc.fr/item/NANO_2015_6_3_a2/