Geodesic
Methodology for chip-package-board design of server
Informacionnye tehnologii i vyčislitelnye sistemy, no. 4 (2015), pp. 3-12.

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This paper describes comprehensive optimization methodology for chip-package-board design of multiprocessor server. Optimum decisions for the motherboard and the processor can be defined only on condition of their co-design process. Original set of approaches and methods of considered methodology was repeatedly put into practice for multi-core processor and motherboard designs of multi-processor servers. Printed circuit board (PCB) and electronic components optimization is iteratively carried out, since early design stages of the processor. It is proposed to take planning of the motherboard for selection from options of processor’s components (I/O padring and IC package components) into account. Application of the proposed optimization methodology to co-design process had improved technical and economic characteristics of computer systems under development. Development of the successful motherboard with four processors for the Elbrus-4.4 server is the result of optimization methodology introduction to co-design process.
Keywords: Multi-objective optimization, multi-core processor, multiprocessor system, co-design. 
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     author = {I. N. Bychkov},
     title = {Methodology for chip-package-board design of server},
     journal = {Informacionnye tehnologii i vy\v{c}islitelnye sistemy},
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     year = {2015},
     language = {ru},
     url = {http://geodesic.mathdoc.fr/item/ITVS_2015_4_a0/}
}
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I. N. Bychkov. Methodology for chip-package-board design of server. Informacionnye tehnologii i vyčislitelnye sistemy, no. 4 (2015), pp. 3-12. http://geodesic.mathdoc.fr/item/ITVS_2015_4_a0/